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 SEMICONDUCTOR
TECHNICAL DATA
General Description
KHB9D0N50P1/F1/F2
N CHANNEL MOS FIELD EFFECT TRANSISTOR
KHB9D0N50P1
A O C F E G B Q I K M L J D N N H P
DIM MILLIMETERS _ 9.9 + 0.2 A B C D E F G H I J K L M N O
1 2 3
This planar stripe MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for electronic ballast and switching mode power supplies. FEATURES
VDSS(Min.)= 500V, ID= 9A Drain-Source ON Resistance : RDS(ON)=0.8 @VGS =10V Qg(typ.) =34.6nC
15.95 MAX 1.3+0.1/-0.05 _ 0.8 + 0.1 _ 3.6 + 0.2 _ 2.8 + 0.1 3.7 0.5+0.1/-0.05 1.5 _ 13.08 + 0.3 1.46 _ 1.4 + 0.1 _ 1.27 + 0.1 _ 2.54 + 0.2 _ 0.2 4.5 + _ 2.4 + 0.2 _ 9.2 + 0.2
MAXIMUM RATING (Tc=25
CHARACTERISTIC
)
RATING SYMBOL KHB9D0N50F1 UNIT KHB9D0N50P1 KHB9D0N50F2 500 30 9 ID 5.4 IDP EAS EAR dv/dt 135 PD 1.07 Tj Tstg 150 -55 150 0.35 W/ 36 360 13.5 4.5 44 5.4* 36* mJ mJ V/ns W
Q 1 2 3 K L M
1. GATE 2. DRAIN 3. SOURCE
P Q
TO-220AB
KHB9D0N50F1
Drain-Source Voltage Gate-Source Voltage @TC=25 Drain Current @TC=100 Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) Drain Power Dissipation Tc=25 Derate above25
VDSS VGSS
V V 9* A
E
A F
C
O
DIM
B
MILLIMETERS
R J
D N N
H
A B C D E F G H J K L M N O Q R
_ 10.16 + 0.2 _ 15.87 + 0.2 _ 2.54 + 0.2 _ 0.8 + 0.1 _ 3.18 + 0.1 _ 3.3 + 0.1 _ 12.57 + 0.2 _ 0.5 + 0.1 13.0 MAX _ 3.23 + 0.1 1.47 MAX 1.47 MAX _ 2.54 + 0.2 _ 6.68 + 0.2 _ 4.7 + 0.2 _ 2.76 + 0.2
G
1. GATE 2. DRAIN 3. SOURCE
Maximum Junction Temperature Storage Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-toAmbient
TO-220IS (1)
KHB9D0N50F2
RthJC RthCS RthJA
0.93 0.5 62.5
2.86 62.5
A
/W
S F
C
/W /W
P
E G B
DIM
MILLIMETERS
* : Drain current limited by maximum junction temperature.
K L L R J
PIN CONNECTION
D
M D
D
N N H
G
1
2
3
A B C D E F G H J K L M N P Q R S
_ 10.0 + 0.3 _ 15.0 + 0.3 _ 0.3 2.70 + 0.76+0.09/-0.05 _ 3.2 +0.2 _ 3.0 + 0.3 _ 12.0 + 0.3 0.5+0.1/-0.05 _ 13.6 + 0.5 _ 3.7 + 0.2 1.2+0.25/-0.1 1.5+0.25/-0.1 _ 2.54 +0.1 _ 6.8 + 0.1 _ 4.5 + 0.2 _ 2.6 + 0.2 0.5 Typ
Q
1. GATE 2. DRAIN 3. SOURCE
S
TO-220IS
2007. 5. 10
Revision No : 0
1/7
KHB9D0N50P1/F1/F2
ELECTRICAL CHARACTERISTICS (Tc=25
CHARACTERISTIC
)
TEST CONDITION MIN. TYP. MAX. UNIT
SYMBOL
Static
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Drain Cut-off Current Gate Threshold Voltage Gate Leakage Current Drain-Source ON Resistance BVDSS BVDSS/ Tj IDSS Vth IGSS RDS(ON) ID=250 A, VGS=0V ID=250 A, Referenced to 25 VDS=500V, VGS=0V, VDS=VGS, ID=250 A VGS= 30V, VDS=0V 500 2.0 0.57 0.65 10 4.0 100 0.8 V V/ A V nA
VGS=10V, ID=4.5A
Dynamic
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Input Capacitance Reverse Transfer Capacitance Output Capacitance Source-Drain Diode Ratings Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS VGSNote 1) Repetivity rating : Pulse width limited by junction temperature. Note 2) L = 8mH, IS=9A, VDD=50V, RG = 25 , Starting Tj = 25 . Note 3) IS 9A, dI/dt 200A/ , VDD 300 BVDSS, Starting Tj = 25 . , Duty Cycle 2%. Note 4) Pulse Test : Pulse width
Note 5) Essentially independent of operating temperature.
2007. 5. 10
Revision No : 0
2/7
KHB9D0N50P1/F1/F2
Fig1. ID - VDS
VGS TOP : 15.0 V 10.0 V 8.0 V 7.0 V 1 6.0 V 10 5.5 V 5.0 V Bottom : 4.5 V
Fig2. ID - VGS
Drain Current ID (A)
Drain Current ID (A)
10
1
150 C
10
0
10
0
25 C -55 C
10
-1
10
-1
10
0
10
1
10
-1
2
4
6
8
10
Drain - Source Voltage VDS (V)
Gate - Source Voltage VGS (V)
Fig3. BVDSS - Tj
Normalized Breakdown Voltage BVDSS
1.2
Fig4. RDS(ON) - ID
2.0
On - Resistance RDS(ON) ()
VGS = 0V IDS = 250A
1.1
1.5
VGS = 10V
1.0
1.0
VGS = 20V
0.9
0.5
0.8 -100
0 -50 0 50 100 150 0 5 10 15 20 25
Junction Temperature Tj ( C )
Drain Current ID (A)
Fig5. IS - VSD
3.0
VGS = 10V IDS = 4.5A
Fig6. RDS(ON) - Tj
Reverse Drain Current IS (A)
Normalized On Resistance
1.0 1.2 1.4
10
1
2.5 2.0 1.5 1.0 0.5
10
0
150 C
25 C
10
-1
0.2
0.4
0.6
0.8
0.0 -100
-50
0
50
100
150
Source - Drain Voltage VSD (V)
Junction Temperature Tj ( C )
2007. 5. 10
Revision No : 0
3/7
KHB9D0N50P1/F1/F2
Fig7. C - VDS
2800 2400 Ciss 12
Frequency = 1MHz ID = 9A
Fig8. Qg- VGS
Gate - Source Voltage VGS (V)
10 8 6 4 2 0 0 5 10
VDS = 100V VDS = 250V VDS = 400V
Capacitance (pF)
2000 1600 1200 800 400 0 10-1 100 101
Crss
Coss
15
20
25
30
35
Drain - Source Voltage VDS (V)
Gate - Charge Qg (nC)
Fig9. Safe Operation Area
(KHB9D0N50P1) 10
2
Fig10. Safe Operation Area
(KHB9D0N50F1,KHB9D0N50F2) 102
10s 100s
Operation in this area is limited by RDS(ON)
Operation in this area is limited by RDS(ON)
10s
Drain Current ID (A)
101 100
Drain Current ID (A)
101 100
100s
1ms
10ms 100ms DC
1ms
10ms 100ms
10-1
Tc= 25 C Tj = 150 C Single nonrepetitive pulse 10-2
10-1
Tc= 25 C Tj = 150 C Single nonrepetitive pulse 10-2
DC
100
101
102
103
100
101
102
103
Drain - Source Voltage VDS (V)
Drain - Source Voltage VDS (V)
Fig11. ID - Tj
10 8 6 4 2 0 25 50 75 100 125 150
Drain Current ID (A)
Junction Temperature Tj ( C)
2007. 5. 10
Revision No : 0
4/7
KHB9D0N50P1/F1/F2
Fig12. Transient Thermal Response Curve
Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM t1 t2
Single Pulse
0.02
0.01
10-2 10-5
- Duty Factor, D= t1/t2 10-3 10-2 10-1 100 101
10-4
TIME (sec)
Fig13. Transient Thermal Response Curve
Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM t1 t2
0.02
10-2
0.01
Single Pulse
- Duty Factor, D= t1/t2 10-2 10-1 100 101
10-5
10-4
10-3
TIME (sec)
2007. 5. 10
Revision No : 0
5/7
KHB9D0N50P1/F1/F2
Fig14. Gate Charge
VGS 10 V ID Fast Recovery Diode
0.8 VDSS 1.0 mA
ID
VDS Qgs VGS Qgd Qg
Q
Fig15. Single Pulsed Avalanche Energy
EAS= 1 LIAS2 2
BVDSS BVDSS - VDD
BVDSS
L
IAS
0.5 VDSS
25 VDS ID(t)
VDD
10 V VGS
VDS(t)
Time tp
Fig16. Resistive Load Switching
VDS RL 0.5 VDSS 25 VGS 10% tf 10V td(on) VGS ton tr td(off) toff 90%
VDS
2007. 5. 10
Revision No : 0
6/7
KHB9D0N50P1/F1/F2
Fig17. Source - Drain Diode Reverse Recovery and dv /dt
DUT VDS IF
Body Diode Forword Current
ISD (DUT)
IRM
di/dt
IS
Body Diode Reverse Current
0.8 x VDSS
VDS (DUT) driver Body Diode Recovery dv/dt VSD VDD 10V
VGS
Body Diode Forword Voltage drop
2007. 5. 10
Revision No : 0
7/7


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